From FEOL Buildups to IC Chip: A Full Correlation of Galvanic Micro-Pitting on AlCu Pads
Author:
Affiliation:
1. Quality and Reliability,Pocatello,ID,USA,83201
2. Automotive Product Engineering,Pocatello,ID,USA,83201
3. Automotive Product Design,Brno,Czech Republic,619 00
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10032732/10032733/10032767.pdf?arnumber=10032767
Reference5 articles.
1. The Dynamic Aspects of Electrochemical Reaction Cells in Selectively Inducing Defects on Silicon Surface
2. Galvanic corrosion mechanism and suppressed solution on Al/Cu pads
3. Al-Cu metal bond pad corrosion during wafer saw;fauty;Int J Microcirc Electron Packag,2001
4. Failure anlaysis of pitting problem on microchip Al bondpads in wafer fabrication;eve;Proc of IEEE Interntional Conference on Semiconductor Electronsics,2006
5. Micro-Corrosion of Al-Cu Bonding Pads
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