Etching Process to Reduce Interlamination Short Circuits and Core Loss Comparison for Tape-Wound Cut Cores-Reference-Cited by-同舟云学术

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Etching Process to Reduce Interlamination Short Circuits and Core Loss Comparison for Tape-Wound Cut Cores

Published:2022-06-26 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 13th International Symposium on Power Electronics for Distributed Generation Systems (PEDG)
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Author:

Gomez Roderick A.¹,Christian Shamar F.¹,Oggier German G.²,Fantino Roberto A.³,Balda Juan C.¹,Zhao Yue¹

Affiliation:

1. University of Arkansas,Department of Electrical Engineering,Fayetteville,United States

2. Universidad Nacional de Río Cuarto (UNRC),Grupo de Electrónica Aplicada (GEA),Río Cuarto Córdoba,Argentina

3. Universidad Nacional del Sur (UNS),Instituto de Investigaciones en Ingeniería Eléctrica (IIIE) “Alfredo Desages” (UNS-CONICET),Bahía Blanca,Argentina

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9922953/9923051/09923076.pdf?arnumber=9923076

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