Thermal discomfort in the workplace: measurement through the combined use of wearable sensors and machine learning algorithms-Reference-Cited by-同舟云学术

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Thermal discomfort in the workplace: measurement through the combined use of wearable sensors and machine learning algorithms

Published:2022-06-07 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE International Workshop on Metrology for Industry 4.0 & IoT (MetroInd4.0&IoT)
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Author:

Mansi Silvia Angela¹,Cosoli Gloria²,Pisello Anna Laura³,Pigliautile Ilaria³,Revel Gian Marco²,Arnesano Marco¹

Affiliation:

1. Universitá degli studi di eCampus,Faculty of Engineering,Novedrate,Italy

2. Universitá Politecnica delle Marche,Dept. of Industrial Engineering and Mathematical Sciences,Ancona,Italy

3. Universitá di Perugia,Centro interuniversitario sull'inquinamento e l'ambiente M. Felli,Department of Engineering,Perugia,Italy

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9831192/9831456/09831610.pdf?arnumber=9831610

Reference32 articles.

1. Learning classifiers for analysis of Blood Volume Pulse signals in IoT-enabled systems

2. On distribution-free multiple comparisons in the one-way analysis of variance

3. Methodology and Application of the Kruskal-Wallis Test

4. A meta-analysis of heart rate variability and neuroimaging studies: Implications for heart rate variability as a marker of stress and health

5. Differences between EEG during thermal discomfort and thermal displeasure

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Off-the-shelf wearable sensing devices for personalized thermal comfort models: A systematic review on their use in scientific research;Journal of Building Engineering;2023-07

2. How to Measure Stress in Smart and Intelligent Manufacturing Systems: A Systematic Review;Systems;2023-03-23

3. Wearable Devices in Industry 4.0: A Systematic Literature Review;Distributed Computing and Artificial Intelligence, Special Sessions I, 20th International Conference;2023

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