SLM Subsystem for Automotive SoC: Case Study on Path Margin Monitor-Reference-Cited by-同舟云学术

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SLM Subsystem for Automotive SoC: Case Study on Path Margin Monitor

Published:2023-10-07 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE International Test Conference (ITC)
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Author:

Kandula Kranthi¹,Kolisetti Ramalingam¹,Tshagharyan Grigor²,Harutyunyan Gurgen²,Zorian Yervant³

Affiliation:

1. Synopsys,Hyderabad,India

2. Synopsys,Yerevan,Armenia

3. Synopsys,Mountain View,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10350036/10350038/10351117.pdf?arnumber=10351117

Reference12 articles.

1. Self-driving cars: from 2020 you will become a permanent backseat driver

2. Its 2020. Where are our self-driving cars?

3. The road ahead for self-driving cars: The AV industry has had to reset expectations, as it shifts its focus to level 4 autonomy - [News]

4. Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon interposer base

5. Road vehicles - Functional safety

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Silicon Correlation in SLM: An Integrated Strategy for Chip Performance Optimization;2024 IEEE 8th International Test Conference India (ITC India);2024-07-21

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