A Flip-Chip-Packaged 25.3 dBm Class-D Outphasing Power Amplifier in 32 nm CMOS for WLAN Application-Reference-Cited by-同舟云学术

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A Flip-Chip-Packaged 25.3 dBm Class-D Outphasing Power Amplifier in 32 nm CMOS for WLAN Application

Published:2011-07 Issue:7 Volume:46 Page:1596-1605
ISSN:0018-9200
Container-title:IEEE Journal of Solid-State Circuits
language:
Short-container-title:IEEE J. Solid-State Circuits

Author:

Xu Hongtao,Palaskas Yorgos,Ravi Ashoke,Sajadieh Masoud,El-Tanani Mohammed A.,Soumyanath Krishnamurthy

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/4/5928962/05776719.pdf?arnumber=5776719

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