Strain Sensing Sheets for Structural Health Monitoring Based on Large-Area Electronics and Integrated Circuits-Reference-Cited by-同舟云学术

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Strain Sensing Sheets for Structural Health Monitoring Based on Large-Area Electronics and Integrated Circuits

Published:2016-08 Issue:8 Volume:104 Page:1513-1528
ISSN:0018-9219
Container-title:Proceedings of the IEEE
language:
Short-container-title:Proc. IEEE

Author:

Glisic Branko,Yao Yao,Tung Shue-Ting E.,Wagner Sigurd,Sturm James C.,Verma Naveen

Funder

National Science Foundation

USDOT-RITA UTC Program

Princeton Institute for the Science and Technology of Materials

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/5/7515131/07498639.pdf?arnumber=7498639

Cited by 49 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Extraction and measurement of recessive and conventional cracks in underground engineering concrete structures;Journal of Building Engineering;2024-10

2. A comprehensive review on triboelectric sensors and AI-integrated systems;Materials Today;2024-09

3. References;Introduction to Strain‐Based Structural Health Monitoring of Civil Structures;2024-06-28

4. Sensing skin technology for structural health monitoring: from proof-of-concept to field validation;Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2024;2024-05-09

5. Distributed strain monitoring method for structural vibration based on multi-point acceleration measurement;Measurement;2024-05

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