Technology Prospects for Data-Intensive Computing

Author:

Akarvardar Kerem1ORCID,Wong H. -S. Philip1ORCID

Affiliation:

1. Taiwan Semiconductor Manufacturing Company (TSMC), Corporate Research, San Jose, CA, USA

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Moiré synaptic transistor with room-temperature neuromorphic functionality;Nature;2023-12-20

2. Exploration of a neural-network-based joint method of mapping and wavelength assignment in optical network-on-chip;Journal of Optical Communications and Networking;2023-08-11

3. Efficient Parallelization of Dynamic Programming for Large Applications;Practice and Experience in Advanced Research Computing;2023-07-23

4. Emerging Hardware Technologies and 3D System Integration for Ubiquitous Machine Intelligence;2023 60th ACM/IEEE Design Automation Conference (DAC);2023-07-09

5. Ultra High Density Low Temperature SoIC with Sub-0.5 μm Bond Pitch;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

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