Enabling Electronics With Physically Flexible ICs and Hybrid Manufacturing-Reference-Cited by-同舟云学术

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Enabling Electronics With Physically Flexible ICs and Hybrid Manufacturing

Published:2015-04 Issue:4 Volume:103 Page:633-643
ISSN:0018-9219
Container-title:Proceedings of the IEEE
language:
Short-container-title:Proc. IEEE

Author:

Hackler Douglas,Sime David G.,Wald Steven F.

Funder

Air Force Research Laboratory

FlexTech Alliance Development Agreement

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/5/7110409/07110432.pdf?arnumber=7110432

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Nozzle‐Free Printing of CNT Electronics Using Laser‐Generated Focused Ultrasound;Small Methods;2024-03-12

2. Thermal Conductivity of Printed Thin Metals Using Modulated Photothermal Radiometry;2023 IEEE International Flexible Electronics Technology Conference (IFETC);2023-08-13

3. Laser Sintering of Various Film Compositions Used in Flexible Printed Electronics;2023 IEEE International Flexible Electronics Technology Conference (IFETC);2023-08-13

4. Adoption of wearable technology: Risk and success factors;Fashion, Style & Popular Culture;2022-10-01

5. Review of Computer-Aided Manufacturing (CAM) strategies for hybrid directed energy deposition;Additive Manufacturing;2022-08

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