6.5 A 0.5° - Resolution Hybrid Dual-Band Ultrasound Imaging SoC for UAV Applications-Reference-Cited by-同舟云学术

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6.5 A 0.5° - Resolution Hybrid Dual-Band Ultrasound Imaging SoC for UAV Applications

Published:2024-02-18 Issue: Volume: Page:108-110
ISSN:
Container-title:2024 IEEE International Solid-State Circuits Conference (ISSCC)
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Author:

Guo Jiaqi¹,Feng Junwei¹,Chen Silin¹,Wu Liuhao¹,Tsai Chne-Wuen¹,Huang Yingna¹,Lin Bochi¹,Yoo Jerald¹

Affiliation:

1. National University of Singapore,Singapore,Singapore

Funder

National Research Foundation

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10454133/10454267/10454469.pdf?arnumber=10454469

Reference5 articles.

1. 7.6 A High-Speed Back-Illuminated Stacked CMOS Image Sensor with Column-Parallel kT/C-Cancelling S&H and Delta-Sigma ADC

2. 7.3 A 189×600 Back-Illuminated Stacked SPAD Direct Time-of-Flight Depth Sensor for Automotive LiDAR Systems

3. BatDrone: A 9.83M-focal-points/s 7.76μs-Latency Ultrasound Imaging System with On-Chip Per-Voxel RX Beam-Focusing for 7m-Range Drone Applications;Wu;ISSCC,2022

4. A Pitch-Matched ASIC with Integrated 65V TX and Shared Hybrid Beamforming ADC for Catheter-Based High-Frame-Rate 3D Ultrasound Probes

5. 3D Ultrasonic Rangefinder on a Chip

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