20.1 NVE: A 3nm 23.2TOPS/W 12b-Digital-CIM-Based Neural Engine for High-Resolution Visual-Quality Enhancement on Smart Devices-Reference-Cited by-同舟云学术

20.1 NVE: A 3nm 23.2TOPS/W 12b-Digital-CIM-Based Neural Engine for High-Resolution Visual-Quality Enhancement on Smart Devices

Published:2024-02-18 Issue: Volume: Page:360-362
ISSN:
Container-title:2024 IEEE International Solid-State Circuits Conference (ISSCC)
language:
Short-container-title:

Author:

Shih Ming-En¹,Hsieh Shih-Wei¹,Tsai Ping-Yuan¹,Lin Ming-Hung¹,Tsung Pei-Kuei¹,Chang En-Jui¹,Liang Jenwei¹,Chang Shu-Hsin¹,Huang Chung-Lun¹,Nian You-Yu¹,Wan Zhe²,Kumar Sushil²,Xue Cheng-Xin¹,Jedhe Gajanan²,Fujiwara Hidehiro³,Mori Haruki³,Chen Chih-Wei¹,Huang Po-Hua¹,Juan Chih-Feng¹,Chen Chung-Yi¹,Lin Tsung-Yao¹,Wang Ch¹,Chen Chih-Cheng¹,Jou Kevin¹

Affiliation:

1. MediaTek,Hsinchu,Taiwan

2. MediaTek,San Jose,CA

3. TSMC,Hsinchu,Taiwan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10454133/10454267/10454482.pdf?arnumber=10454482

Reference6 articles.

1. A 4nm 6163-TOPS/W/b 4790-TOPS/mm2/b SRAM Based Digital-Computing-in-Memory Macro Supporting Bit-Width Flexibility and Simultaneous MAC and Weight Update;Mori

2. DepFiN: A 12nm, 3.8TOPs depth-first CNN processor for high res. image processing

3. A Multi-Mode 8K-MAC HW-Utilization-Aware Neural Processing Unit with a Unified Multi-Precision Datapath in 4nm Flagship Mobile SoC

4. A 28nm 11.2TOPS/W Hardware-Utilization-Aware Neural-Network Accelerator with Dynamic Dataflow

5. VISTA: A 704mW 4K-UHD CNN Processor for Video and Image Spatial/Temporal Interpolation Acceleration

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Survey of Deep Learning Accelerators for Edge and Emerging Computing;Electronics;2024-07-29

2. Towards efficient generative AI and beyond-AI computing: New trends on ISSCC 2024 machine learning accelerators;Journal of Semiconductors;2024-04-01