Tech-Wrapped Recovery: Exploring the world of Band-Aid 2.0
Author:
Affiliation:
1. Rajalakshmi Institute of Technology,Computer Science and Engineering,Chennai,India
2. Sree Sastha Institute of Engineering and Technology,Computer Science and Engineering,Chennai,India
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10464384/10465267/10465365.pdf?arnumber=10465365
Reference19 articles.
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3. Skin mechanical properties and modeling: A review
4. Smart bioadhesives for wound healing and closure
5. Smart Bandage With Wireless Strain and Temperature Sensors and Batteryless NFC Tag
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