Special Session: Physical Attacks through the Chip Backside: Threats, Challenges, and Opportunities-Reference-Cited by-同舟云学术

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Special Session: Physical Attacks through the Chip Backside: Threats, Challenges, and Opportunities

Published:2021-04-25 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 39th VLSI Test Symposium (VTS)
language:
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Author:

Amini Elham¹,Bartels Kai²,Boit Christian¹,Eggert Marius²,Herfurth Norbert³,Kiyan Tuba¹,Krachenfels Thilo¹,Seifert Jean-Pierre¹,Tajik Shahin⁴

Affiliation:

1. Technische Universität Berlin,Chair of Security in Telecommunications,Germany

2. Digital Electronics and Data Reconstruction, Federal Criminal Police Office,Germany

3. Leibniz-Institut für innovative Mikroelektronik (IHP),Germany

4. Worcester Polytechnic Institute,USA

Funder

Deutsche Forschungsgemeinschaft

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9440994/9440995/09441006.pdf?arnumber=9441006

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Comparative Study of E-beam and Optical Probing Approaches in Attacking the ICs;Journal of Failure Analysis and Prevention;2024-08-28

2. Voronoi Based Multidimensional Parameter Optimization for Fault Injection Attacks;2023 Workshop on Fault Detection and Tolerance in Cryptography (FDTC);2023-09-10

3. Hidden in Plain Sight: A Detailed Investigation of Selectively Increasing Local Density to Camouflage and Robustify Against Optical Probing Attacks;2023 IEEE International Test Conference India (ITC India);2023-07-23

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