4.1 A 7nm 5G Mobile SoC Featuring a 3.0GHz Tri-Gear Application Processor Subsystem-Reference-Cited by-同舟云学术

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4.1 A 7nm 5G Mobile SoC Featuring a 3.0GHz Tri-Gear Application Processor Subsystem

Published:2021-02-13 Issue: Volume: Page:
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Container-title:2021 IEEE International Solid- State Circuits Conference (ISSCC)
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Author:

Chen Hsinchen,Lagerquist Rolf,Nayak Ashish,Mair Hugh,Manoharan Gokulakrishnan,Wang Ericbill,Gammie Gordon,Ho Efron,Rajagopalan Anand,Yong Lee-Kee,Madhavaram Ramu,Jagota Madhur,Chung Chi-Jui,Maruthi Sudhakar,Wiedemeier Jenny,Chen Tao,Hsieh Henry,Dia Daniel,Sikiligiri Amjad,Rahman Manzur,Chen Barry,Lin Curtis,Lin Vincent,Chiang Elly,Wu Cheng-Yuh,Hsu Po-Yang,Tsai Jason,Wu Wade,Thippana Achuta,Huang SA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9365732/9365735/09365774.pdf?arnumber=9365774

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. 14.3 A 3nm Adaptive Clock Duty-Cycle Controller for Mitigating Aging-Induced Clock Duty-Cycle Distortion;2024 IEEE International Solid-State Circuits Conference (ISSCC);2024-02-18

2. A Four-Phase Time-Based Switched-Capacitor LDO With 13-ns Settling Time at 0.5-V Input for Energy-Efficient Computing in SoC Applications;IEEE Journal of Solid-State Circuits;2024-02

3. A 5nm 3.4GHz Tri-Gear ARMv9 CPU Subsystem in a Fully Integrated 5G Flagship Mobile SoC;2022 IEEE International Solid- State Circuits Conference (ISSCC);2022-02-20

4. Self-Sensing Processor Systems: Robust sensors and actuator systems;IEEE Solid-State Circuits Magazine;2022

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