A 3-Wafer-Stacked Hybrid 15MPixel CIS + 1 MPixel EVS with 4.6GEvent/s Readout, In-Pixel TDC and On-Chip ISP and ESP Function-Reference-Cited by-同舟云学术

A 3-Wafer-Stacked Hybrid 15MPixel CIS + 1 MPixel EVS with 4.6GEvent/s Readout, In-Pixel TDC and On-Chip ISP and ESP Function

Published:2023-02-19 Issue: Volume: Page:
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Container-title:2023 IEEE International Solid- State Circuits Conference (ISSCC)
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Author:

Guo Menghan¹,Chen Shoushun¹,Gao Zhe²,Yang Wenlei¹,Bartkovjak Peter²,Qin Qing²,Hu Xiaoqin¹,Zhou Dahei¹,Uchiyama Masayuki²,Kudo Yoshiharu³,Fukuoka Shimpei³,Xu Chengcheng²,Ebihara Hiroaki²,Wang Andy²,Jiang Peiwen²,Jiang Bo²,Mu Bo²,Chen Huan¹,Yang Jason²,Dai TJ²,Suess Andreas²

Affiliation:

1. OmniVision Technologies,Shanghai,China

2. OmniVision Technologies,Santa Clara,CA

3. OmniVision Technologies,Yokohama,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10067248/10067251/10067476.pdf?arnumber=10067476

Reference6 articles.

1. Event-Based Vision: A Survey

2. A 1280x720 Back-Illuminated Stacked Temporal Contrast Event-Based Vision Sensor with 4.86µm Pixels, 1.066GEPS Readout, Programmable Event-Rate Controller and Compressive Data-Formatting Pipeline;Finateu;ISSCC,2020

3. 4.1 A 640×480 dynamic vision sensor with a 9µm pixel and 300Meps address-event representation

4. A 1280x960 Dynamic Vision Sensor with a 4.95-um Pixel Pitch and Motion Artifact Minimization;Suh;ISCAS,2020

5. Development of Event-based Sensor and Applications;Chen

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