1. 3-D Vision and Intelligent Online Inspection in SMT Microelectronic Packaging: A Review;IEEE Journal of Emerging and Selected Topics in Industrial Electronics;2024-04
2. Height Measurement for Solder Ball Point Cloud;2023 2nd International Conference on Artificial Intelligence, Human-Computer Interaction and Robotics (AIHCIR);2023-12-08
3. A process method for making BGA solder mask using nickel oxide;2023 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM);2023-07-15
4. Aligning system for a pick-and-place BGA soldering equipment;Revista de la Invención Técnica;2022-06-30
5. Types;Electronic Enclosures, Housings and Packages;2019