A PCBA Solder Joint Defects Inspection System Based on Deep Learning Technology

Author:

Chen Ming-Che1,Chang Wan-Jung1,Chen Zhen-Hao1,Hsu Chia-Hao1,Chiu Yi-Chan1,Su Jian-Ping1,Cheng Tsung-Sheng1

Affiliation:

1. Southern Taiwan University of Science and Technology,Department of Electronic Engineering,Tainan,Taiwan

Publisher

IEEE

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. ReProInspect: Framework for Reproducible Defect Datasets for Improved AOI of PCBAs;Engineering of Computer-Based Systems;2023-11-29

2. Deep Learning Based Printed Circuit Boards Defect Detection Using Multiple Depth 2D X-Ray Image;2023 15th International Conference on Information Technology and Electrical Engineering (ICITEE);2023-10-26

3. Printed circuit board inspection using computer vision;Multimedia Tools and Applications;2023-07-14

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