Author:
Venkatesan S.,Gelatos A.V.,Hisra S.,Smith B.,Islam R.,Cope J.,Wilson B.,Tuttle D.,Cardwell R.,Anderson S.,Angyal M.,Bajaj R.,Capasso C.,Crabtree P.,Das S.,Farkas J.,Filipiak S.,Fiordalice B.,Freeman M.,Gilbert P.V.,Herrick M.,Jain A.,Kawasaki H.,King C.,Klein J.,Lii T.,Reid K.,Saaranen T.,Simpson C.,Sparks T.,Tsui P.,Venkatraman R.,Watts D.,Weitzman E.J.,Woodruff R.,Yang I.,Bhat N.,Hamilton G.,Yu Y.
Cited by
109 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Thermal kinetics of free volume in porous spin-on dielectrics: Exploring the network- and pore-properties;Microporous and Mesoporous Materials;2020-12
2. Advanced single precursor based pSiCOH k = 2.4 for ULSI interconnects;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2017-03
3. Improvements of Stress Migration in Nano-Scaled Copper Interconnects;Science of Advanced Materials;2017-01-01
4. Electromigration behavior of Cu metallization interfacing with Ta versus TaN at high temperatures;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2016-11
5. PECVD low and ultralow dielectric constant materials: From invention and research to products;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2016-03