Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
7 articles.
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1. Tridiagonal Approaches for Network Identification by Deconvolution;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
2. Structure Curve Representation of Dynamic Thermal Multi-Ports;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
3. Fast, Analytical Method for Structured Identification of SISO RC-Ladder-Type Systems;IEEE Transactions on Circuits and Systems II: Express Briefs;2023
4. Determining the Contribution of Spatial Sub-Regions to Structure Functions;2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2022-09-28
5. J-Fraction Approach for Calculating Thermal Structure Functions;2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2022-09-28