Funder
Electronic Components and Systems for European Leadership (ECSEL) Joint Undertaking
Important Project of Common European Interest
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
9 articles.
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1. Study of X-Parameters Modeling for Microwave Power Devices Based on ANNs;2023 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO);2023-06-28
2. 22-nm FDSOI CMOS Noise Modeling and Analysis in mm-Wave Frequency Range;2023 IEEE 23rd Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems;2023-01-22
3. High linearity U-band power amplifier design: a novel intermodulation point analysis method;Frontiers of Information Technology & Electronic Engineering;2023-01
4. A Novel Wiener-Type Dynamic Neural Network Method for Large Signal Modeling of Power Amplifiers;2023
5. Large Signal Modeling for Microwave Power Devices Based on LSTM;2022 IEEE 10th Joint International Information Technology and Artificial Intelligence Conference (ITAIC);2022-06-17