Author:
Zimmermann Martin,Burghartz Joachim N.,Appel Wolfgang,Remmers Nils,Burwick Christian,Wurz Roland,Tobail Osama,Schubert Markus,Palfinger Gunther,Werner Jurgen
Cited by
13 articles.
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1. Motivation;Ultra-Thin Sensors and Data Conversion Techniques for Hybrid System-in-Foil;2022
2. Single-needle Peeling;Modeling and Application of Flexible Electronics Packaging;2019
3. Ultra-thin chips for high-performance flexible electronics;npj Flexible Electronics;2018-03-14
4. Porous silicon reorganization: Influence on the structure, surface roughness and strain;Journal of Crystal Growth;2015-12
5. Stress analysis of ultra-thin silicon chip-on-foil electronic assembly under bending;Semiconductor Science and Technology;2014-08-01