Author:
Zhang Lei,Meng Yuanyuan,Xian Yi,Zhang Wei,Zhou Haifeng,Fang Jingxun,Zhang Yu
Cited by
3 articles.
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1. A Trade-Off Balance Between CU Corrosion and CU Oxide DEFECT;2024 Conference of Science and Technology for Integrated Circuits (CSTIC);2024-03-17
2. Pattern Loading Improvement for CU CMP Process;2023 China Semiconductor Technology International Conference (CSTIC);2023-06-26
3. An Optimized Method for Cu CMP Dishing Improvement;2022 China Semiconductor Technology International Conference (CSTIC);2022-06-20