Electromigration failure mechanism studies on copper interconnects-Reference-Cited by-同舟云学术

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Electromigration failure mechanism studies on copper interconnects

Published: Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519)
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Author:

Fischer A.H.,von Glasow A.,Penka S.,Ungar F.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/7918/21830/01014913.pdf?arnumber=1014913

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