Electroless deposited CoWB for copper diffusion barrier metal
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/7918/21830/01014958.pdf?arnumber=1014958
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Research Progress of Electroless Plating Technology in Chip Manufacturing;Acta Chimica Sinica;2022
2. Mobility and perpendicular magnetic anisotropy in electrodeposited Co 32 Fe 67 B 1 thin films using boric acid as boron source;Journal of Magnetism and Magnetic Materials;2018-07
3. Electroless Deposition Processes and Tools;Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications;2009
4. The linear regression method for improving magnetic parameter of the electroless CoFeB films;Journal of Wuhan University of Technology-Mater. Sci. Ed.;2008-04
5. Soft magnetic peculiarities of the electroless magnetic loss CoFeB films;Materials Science and Engineering: B;2007-02
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