Author:
Vicedo Marcus Miguel V.,Cruz Febus Reidj G.,Garcia Ramon G.
Cited by
2 articles.
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1. Large, High Conductivity Direct-Fill Copper Thermal Vias for High Power Devices;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
2. Next-generation Packaging Enabled by an Engineered Copper Nanomaterial;2021 IEEE 21st International Conference on Nanotechnology (NANO);2021-07-28