Multichip packaging technology with laser-patterned interconnects-Reference-Cited by-同舟云学术

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Multichip packaging technology with laser-patterned interconnects

Published:1989 Issue:4 Volume:12 Page:646-649
ISSN:0148-6411
Container-title:IEEE Transactions on Components, Hybrids, and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Comp., Hybrids, Manufact. Technol.

Author:

Barfknecht A.T.,Tuckerman D.B.,Kaschmitter J.L.,McWilliams B.M.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,General Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx1/33/1825/00049028.pdf?arnumber=49028

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design and performance of a noncontacting probe for measurements on high-frequency planar circuits;IEEE Transactions on Microwave Theory and Techniques;1992

2. State-of-the-art multichip modules for avionics;IEEE Transactions on Components, Hybrids, and Manufacturing Technology;1992

3. Multichip packaging for very-high-speed digital systems;Applied Surface Science;1990-12

4. Laser Induced Gold Deposition on Polyimide Layers;Micro System Technologies 90;1990

5. Plane Surface Embedding Technique for Thin Film Hybrids;Micro System Technologies 90;1990

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