Author:
Kursun Eren,Cher Chen-Yong
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Cited by
24 articles.
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1. Finding the minimum quantity and the optimum placement of on-die temperature sensor in SOC design based on rank analysis;2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2021-06-01
2. Experimental Characterization of Variation in Power Consumption for Processors of Different Generations;2019 International Conference on Internet of Things (iThings) and IEEE Green Computing and Communications (GreenCom) and IEEE Cyber, Physical and Social Computing (CPSCom) and IEEE Smart Data (SmartData);2019-07
3. Hotspot thermal management using a microchannel-pinfin hybrid heat sink;International Journal of Thermal Sciences;2018-12
4. Potential effects on server power metering and modeling;Wireless Networks;2018-11-29
5. Detecting Data Center Cooling Problems Using a Data-driven Approach;Proceedings of the 9th Asia-Pacific Workshop on Systems;2018-08-27