Study on Relationship of the Material Removal Amount and the Increase in Abrasive Nanoparticle Size during Si-CMP-Reference-Cited by-同舟云学术

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Study on Relationship of the Material Removal Amount and the Increase in Abrasive Nanoparticle Size during Si-CMP

Published:2018-04 Issue: Volume: Page:
ISSN:
Container-title:2018 Third International Conference on Engineering Science and Innovative Technology (ESIT)
language:
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Author:

Boripatkosol Siriwan,Bun-Athuek Natthaphon,Khajornrungruang Panart,Suzuki Keisuke,Chanthawong Narin,Phaisalpanumas Pipat

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8663265/8665017/08665198.pdf?arnumber=8665198

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Recent Developments in Chemical Mechanical Polishing (CMP) for Precision Manufacturing;International Journal of Advanced Research in Science, Communication and Technology;2022-02-27

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