Author:
Chang Kyungwook,Das Shidhartha,Sinha Saurabh,Cline Brian,Yeric Greg,Lim Sung Kyu
Cited by
3 articles.
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1. IR Drop Analysis for Power Integrity in 3D ICs;2024 International Conference on Integrated Circuits, Communication, and Computing Systems (ICIC3S);2024-06-08
2. Physical Design Challenges and Solutions for Emerging Heterogeneous 3D Integration Technologies;Proceedings of the 2021 International Symposium on Physical Design;2021-03-21
3. Logic Monolithic 3D ICs;Proceedings of the 2019 on Great Lakes Symposium on VLSI;2019-05-13