Author:
Chang Kyungwook,Das Shidhartha,Sinha Saurabh,Cline Brian,Yeric Greg,Lim Sung Kyu
Cited by
2 articles.
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1. Physical Design Challenges and Solutions for Emerging Heterogeneous 3D Integration Technologies;Proceedings of the 2021 International Symposium on Physical Design;2021-03-21
2. Logic Monolithic 3D ICs;Proceedings of the 2019 on Great Lakes Symposium on VLSI;2019-05-13