SPV Panel Hotspot Thermal Profile Modeling and Characterization with Active Cooling Employing CAD Simulation
Author:
Affiliation:
1. School of Electronics Engineering Vellore Institute of Technology,Vellore,India
2. Indian Institute of Information Technology Allahabad,Department of Electronics and Communication Engineering,Prayagraj,India
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9774032/9773333/09774059.pdf?arnumber=9774059
Reference17 articles.
1. A novel heat exchanger design procedure for photovoltaic panel cooling application: An analytical and experimental evaluation
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3. Non-uniform intensity mapping using high performance enterprise computing system;prakash;U S Patent,2018
4. Power optimisation of small scale SPV array using field programmable reconfiguration topology for dynamic non‐uniform illumination state
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