A Novel Layered Architecture and Modular Design Framework for Next-gen Cyber Physical System-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

A Novel Layered Architecture and Modular Design Framework for Next-gen Cyber Physical System

Published:2022-01-25 Issue: Volume: Page:
ISSN:
Container-title:2022 International Conference on Computer Communication and Informatics (ICCCI)
language:
Short-container-title:

Author:

Mishra Ayaskanta¹,Ray Arun Kumar¹

Affiliation:

1. School of Electronics Engineering, Kalinga Institute of Industrial Technology,Bhubaneswar,India

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9740652/9740653/09740757.pdf?arnumber=9740757

Reference13 articles.

1. Big data analytics – enabled cyber-physical system: model and applications

2. Cyber-physical manufacturing cloud: Architecture, virtualization, communication, and testbed

3. The AXIOM platform for next-generation cyber physical systems

4. Foundational elements of next generation cyber physical and IoT frameworks for distributed collaboration

5. A Cyber-Physical Systems architecture for Industry 4.0-based manufacturing systems

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Advancements in Artificial Intelligence Circuits and Systems (AICAS);Electronics;2023-12-26

2. A Literature Review on the Development and Creation of Digital Twins, Cyber-Physical Systems, and Product-Service Systems;Sensors;2023-12-12

3. Water Quality Estimation and Anomaly Detection: A Review;EAI Endorsed Transactions on Internet of Things;2023-10-18

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP