Effects of Insulation Residues on the Contacting Process of Copper Flat Wire Connections-Reference-Cited by-同舟云学术

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Effects of Insulation Residues on the Contacting Process of Copper Flat Wire Connections

Published:2022-10-23 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 67th Holm Conference on Electrical Contacts (HLM)
language:
Short-container-title:

Author:

Kuehl Alexander¹

Affiliation:

1. Institute for Factory Automation and Production Systems Friedrich-Alexander-Universität,Erlangen-Nürnberg (FAU),Germany

Funder

Federal Ministry for Economic Affairs and Energy (BMWi)

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9969582/9969766/09969811.pdf?arnumber=9969811

Reference19 articles.

1. Flex-Wiring und MID substituieren konventionelle Leitungssätze;czabanski;Draht,2000

2. Challenges and Solutions for Contacting Insulated Litz Wire Structures in the Context of Electromechanical Engineering;seefried;Lecture Notes in Production Engineering Production at the leading edge of technology,2021

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Methodological comparison of laser stripping solutions with contemporary pulsed lasers for e-drive copper hairpins;Production Engineering;2023-12-10

2. Optimized Cutting Process of Flat Wires for Electric Motors with Hairpin Technology;2023 IEEE International Electric Machines & Drives Conference (IEMDC);2023-05-15

3. Adaptive Control of Grinding Process based on Grinding Force for Removing the Coating from an Enameled Copper Wire;Journal of the Korean Society for Precision Engineering;2023-05-01

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