Failure Mechanism Analysis of Bond Wire of High Power IGBT under Different Load Current-Reference-Cited by-同舟云学术

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Failure Mechanism Analysis of Bond Wire of High Power IGBT under Different Load Current

Published:2022-05-27 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 5th International Electrical and Energy Conference (CIEEC)
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Author:

Fu Haodong¹,Li Yangbo¹,Li Qi¹,Tu Chunming¹,Xiao Biao¹,Xiao Fan¹,Liu Ping¹,Gao Bing¹,Lu Jiwu¹

Affiliation:

1. Hunan University,College of Electrical and Information Engineering,Changsha,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9845798/9845816/09846435.pdf?arnumber=9846435

Reference17 articles.

1. Degradation evolution in high power IGBT modules subjected to sinusoidal current load

2. Thermo-mechanical stress of bonded wires used in high power modules with alternating and direct current modes

3. A review of failure mechanism of power devices based on physics-of-failure;xuemei;Trans China Electrotechnical Society,2019

4. Influence and Mechanism Analysis of Load Pulse Duration on Failure Mode of High Power IGBT Module Under Power Cycling Condition;jie;Proceedings of the CSEE,2020

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An Online Monitoring Method for Bond Wire Fatigue in IGBT Module;IEEE Journal of the Electron Devices Society;2024

2. Research on Online Monitoring Method for Bond Wire Fatigue Applied to IGBT Module;Electronics;2023-08-14

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