A comprehensive study of alignment, overlay and leveling in throughput effect under PEP-align for high volume manufacturing fab immersion group
Author:
Affiliation:
1. ChangXin Memory Technologies, Inc,Hefei,Anhui,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9971792/9972241/09972273.pdf?arnumber=9972273
Reference5 articles.
1. High order wafer alignment for 20nm node logic process
2. Layout independent leveling (LIL) on NXT: 1980Di immersion scanners for enhanced produtivity;hoof;Proc SPIE 10147,2017
3. Advances in process overlay: alignment solutions for future technology nodes
4. Performance results of a new generation of 300mm lithography systems;sluijk;Proc SPIE 4346,0
5. The performance advantages of a dual-stage system
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