Curvilinear OPC Application On 180nm Silicon Photonics Layout For Better Performance-Reference-Cited by-同舟云学术

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Curvilinear OPC Application On 180nm Silicon Photonics Layout For Better Performance

Published:2022-10-21 Issue: Volume: Page:
ISSN:
Container-title:2022 International Workshop on Advanced Patterning Solutions (IWAPS)
language:
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Author:

Wu Qing¹,Li Zhifeng²,Zhu Cynthia³,Peng Lulu⁴,Jin Yadong²,Shao Feng²,Lippincott George³,Liubich Vlad⁵,Cao Guowei¹,Sandhu Avneet³

Affiliation:

1. United Microelectronics Center Corporation (CUMEC),Chongqing,China

2. Siemens Digital Industries Software (Siemens EDA),Shanghai,China

3. Siemens Digital Industries Software (Siemens EDA)

4. United Microelectronics Center Corporation (CUMEC)

5. Siemens Digital Industries Software (Siemens EDA),Wilsonville,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9971792/9972241/09972328.pdf?arnumber=9972328

Reference10 articles.

1. Monolithic integration of photonic and electronic circuits in a CMOS process

2. Silicon Photonics Market and Technology Report,2021

3. A Design-Oriented Approach to Implement Inverse Lithography Technology OPC in Silicon Photonics MPW Platform

4. Preliminary Round of OPC Development in 180nm node Silicon Photonics MPW platform

5. 300-mm Monolithic Silicon Photonics Foundry Technology

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