Original design of field grading materials for high voltage power module applications
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9341294/9341806/09341852.pdf?arnumber=9341852
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Application of Field Grading Material for Power Device Insulation in PCB Embedded Environment;2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP);2023-10-15
2. Thickness Dependence of Epoxy-Based Composites with BaTiO₃ Particles on AC Electrical Breakdown Strength;2022 IEEE 4th International Conference on Dielectrics (ICD);2022-07-03
3. Process optimization for heterogeneous capacitive grading materials by voltage and time monitoring;2021 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP);2021-12-12
4. Exploring Event-Driven Dynamic Context for Accident Scene Segmentation;IEEE Transactions on Intelligent Transportation Systems;2021
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