Two-pads per electrode in-situ test structure for micron-scale flip-chip bonding reliability of chip-on-chip device-Reference-Cited by-同舟云学术

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Two-pads per electrode in-situ test structure for micron-scale flip-chip bonding reliability of chip-on-chip device

Published:2022-03-21 Issue: Volume: Page:
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Container-title:2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS)
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Author:

Ebihara Yusuke¹,Mizushima Ayako¹,Yoda Takashi²,Hirakawa Kenji²,Iwase Masayuki²,Ogasawara Munehiro²,Higo Akio¹,Ochiai Yukinori¹,Mita Yoshio¹

Affiliation:

1. The University of Tokyo,School of Engineering,Japan

2. Tokyo Institute of Technology,Laboratory for Future Interdisciplinary Research of Science and Technology,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9898143/9898103/09898248.pdf?arnumber=9898248

Reference4 articles.

1. Two dimensional micro conveyance system with through holes for electrical and fluidic interconnection

2. An integrated CMOS-MEMS probe having two-tips per cantilever for individual contact sensing and kelvin measurement with two cantilevers

3. Sub-Micron-Accuracy Gold-to-Gold Interconnection Flip-Chip Bonding Approach for Electronics–Optics Heterogeneous Integration

4. A 1/4-inch 8Mpixel back-illuminated stacked CMOS image sensor

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Test Structure to Assess Bump Shape Influence on Hybrid Bonding;2024 IEEE 36th International Conference on Microelectronic Test Structures (ICMTS);2024-04-15

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