Author:
Poliks Mark,Turner James,Ghose Kanad,Jin Zhanpeng,Garg Mohit,Gui Qiong,Arias Ana,Kahn Yasser,Schadt Mark,Egitto Frank
Cited by
29 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Conformal Dry Electrode for ECG Monitoring;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Planar SiC Power Module Packaging and Interconnections Using Direct Ink Writing;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
3. Development of FHE based Wearable Patch for Comfortable, Noninvasive Body Temperature Monitoring;2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS);2022-07-10
4. Cyclic Bending Effects on Resistance of Screen-Printed Silver Conductors;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-11
5. Extracting RLC Parasitics From a Flexible Electronic Hybrid Assembly Using On-Chip ESD Protection Circuits;IEEE Transactions on Circuits and Systems I: Regular Papers;2021-10