Author:
Kim Junghwa,Han Seung,Na Woochul,Kim Soyoon,Kwon Ki Hyeok,Park Deokhoon,Lee Donghwan,Kim Sang Kyun
Cited by
1 articles.
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1. Effective Thermal Solution via Wafer Level Packaging Materials;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06