Multi-layer Electro-Optical Circuit Board Fabrication on Large Panel

Author:

Schroder Henning1,Neitz Marcel2,Whalley Simon3,Herbst Christian2,Frey Christopher1,Lang Klaus-Dieter2

Affiliation:

1. Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany

2. Tech. Univ. of Berlin, Berlin, Germany

3. ILFA Feinstleitertechnik GmbH, Hannover, Germany

Publisher

IEEE

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. A Non-blocking Network Design for Terabit Capacity Optical Interconnects;2022 IEEE 23rd International Conference on High Performance Switching and Routing (HPSR);2022-06-06

2. Low-loss optical single-mode waveguide platform in thin glass with wide spectral range;Optical Interconnects XXII;2022-03-05

3. 基于Ring-Clos的全光交换架构;Acta Optica Sinica;2022

4. Hybrid photonic system integration using thin glass platform technology;Journal of Optical Microsystems;2021-05-14

5. Integrated optical single-mode waveguide structures in thin glass for flip-chip PIC assembly and fiber coupling;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06

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