Author:
Wei Frank,Tabuchi Tomotaka,Lazerand Thierry,Johnston Christopher,Mackenzie Kenneth,Notarianni Marco
Cited by
3 articles.
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1. A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-04
2. Technology Trends for Chip Thinning Process;Journal of The Japan Institute of Electronics Packaging;2019-08-01
3. Optimization of Semiconductor Device Packaging Singulation Process;IOP Conference Series: Materials Science and Engineering;2019-06-01