In-Situ Investigation of Organic Additive Interactions in Copper Electroplating Solutions with Surface Enhanced Raman Spectroscopy (SERS)-Reference-Cited by-同舟云学术

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In-Situ Investigation of Organic Additive Interactions in Copper Electroplating Solutions with Surface Enhanced Raman Spectroscopy (SERS)

Published:2019-05 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
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Author:

Nedumthakady Nithin,DeProspo Bartlet,Sharma Himani,Manepalli Rahul,Kandanur Sashi,Panikkanvalappil Sajanlal,Hooshmand Nasrin,Tummala Rao

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8795274/8811008/08811168.pdf?arnumber=8811168

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Research opportunities of surface enhanced infrared absorption spectroscopy on adsorption behavior of additives for electroplating;SCIENTIA SINICA Chimica;2023-08-23

2. Guidelines for Accurate in-House Electroplating and 3-D-Printing Processes Applied to mm-Wave Devices;IEEE Microwave and Wireless Components Letters;2022-11

3. In Situ Wide-Frequency Surface-Enhanced Infrared Absorption Spectroscopy Enables One to Decipher the Interfacial Structure of a Cu Plating Additive;The Journal of Physical Chemistry Letters;2022-09-26

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