Experimental Investigation of the Correlation between a Load-Based Metric and Solder Joint Reliability of BGA Assemblies on System Level
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/8795274/8811008/08811376.pdf?arnumber=8811376
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component;Journal of Electronic Packaging;2023-05-15
2. Reliability testing of solder joints under combined cyclic thermal and bending load for automotive applications;Microelectronics Reliability;2022-12
3. Test Screening of Solder Joints Under Combined Cyclic Thermal and Bending Load for Automotive Applications;2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2021-04-19
4. Optimized FE Model for System-Level Solder Joint Reliability Analysis of a Flip-Chip Ball Grid Array Package;New Advances in Mechanisms, Mechanical Transmissions and Robotics;2020-10-15
5. System-Level Flip-Chip Ball Grid Array Solder Joint Reliability Assessment Under Different Methodologies and Correlation with Accelerated Thermal Cycling Experimental Data;2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC);2020-09-15
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