Demonstration of Enhanced System-Level Reliability of Ultra-Thin BGA Packages with Circumferential Polymer Collars and Doped Solder Alloys-Reference-Cited by-同舟云学术

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Demonstration of Enhanced System-Level Reliability of Ultra-Thin BGA Packages with Circumferential Polymer Collars and Doped Solder Alloys

Published:2016-05 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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Author:

Singh Bhupender,Huang Ting-Chia,Kawamoto Satomi,Sundaram Venky,Pulugurtha Raj,Smet Vanessa,Tummala Rao

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545604.pdf?arnumber=7545604

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Modeling and Design for System-Level Reliability and Warpage Mitigation of Large 2.5D Glass BGA Packages;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

2. Ultraminiaturized Three-Dimensional IPAC Packages With 100 μm Thick Glass Substrates for Radio Frequency Front-End Modules;Journal of Electronic Packaging;2017-07-27

3. Analysis of System-Level Reliability of Single-Chip Glass BGA Packages with Advanced Solders and Polymer Collars;2017 IEEE 67th Electronic Components and Technology Conference (ECTC);2017-05

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