Author:
Moller Eike,Schiffmacher Alexander,Wijaya Andi,Wilde Jurgen
Cited by
4 articles.
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1. Application of Machine Learning to Recognize Wire Bond Lift-Off in Power Electronics Manufacturing;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
2. In Situ Degradation Monitoring Methods during Lifetime Testing of Power Electronic Modules;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06
3. Thermomechanical Deformations of Power Modules with Sintered Metal Buffer Layers under Consideration of the Operating Time and Conditions;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06
4. Dynamic Stress Measurements of Electronic Devices during Active Operation;2017 IEEE 67th Electronic Components and Technology Conference (ECTC);2017-05