BiCMOS Integrated Microfluidic Packaging by Wafer Bonding for Lab-on-Chip Applications-Reference-Cited by-同舟云学术

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BiCMOS Integrated Microfluidic Packaging by Wafer Bonding for Lab-on-Chip Applications

Published:2017-05 Issue: Volume: Page:
ISSN:
Container-title:2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
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Author:

Inac Mesut,Wietstruck Matthias,Goritz Alexander,Cetindogan Barbaros,Baristiran-Kaynak Canan,Marschmeyer Steffen,Fraschke Mirko,Voss Thomas,Mai Andreas,Palego Cristiano,Pothier Arnaud,Kaynak Mehmet

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7998598/7999654/07999778.pdf?arnumber=7999778

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Integrated Millimeter-Wave and Terahertz Analyzers for Biomedical Applications;IEEE Transactions on Microwave Theory and Techniques;2022-11

2. Towards a fully integrated sub-THz microfluidic sensor platform for dielectric spectroscopy;Frequenz;2022-10-10

3. Dielectrophoretic Immobilization of Yeast Cells Using CMOS Integrated Microfluidics;Micromachines;2020-05-15

4. Towards CMOS Integrated Microfluidics Using Dielectrophoretic Immobilization;Biosensors;2019-06-05

5. (Invited) SiGe BiCMOS Heterogeneous Integration Using Wafer Bonding Technologies;ECS Transactions;2017-08-01

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