Author:
Yang Fan,Liu Sheng,Zhou Zhaoxia,Chen Zhiwen,Liu Li,Liu Canyu,Liu Changqing
Cited by
1 articles.
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1. Bonding of 5 μm Cu-Sn Micro Bumps Using Thermal Reflow and Solid-State Pre-Bonding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-10