Effect of Processing Variables on the Mechanical Reliability of Copper Pillar SnAg Solder Joints-Reference-Cited by-同舟云学术

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Effect of Processing Variables on the Mechanical Reliability of Copper Pillar SnAg Solder Joints

Published:2017-05 Issue: Volume: Page:
ISSN:
Container-title:2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
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Author:

Genanu Mohammed,Mutuku Francis,Cotts Eric J,Wilcox James,Arfaei Babak,Perfecto Eric

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7998598/7999654/07999726.pdf?arnumber=7999726

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of Ag content on microstructure evolution, intermetallic compound (IMC) and mechanical behaviour of SAC solder joints;Microelectronics Reliability;2023-08

2. Growth kinetics of (CuxNi1-x)6Sn5 intermetallic compound at the interface of mixed Sn63Pb37/SAC305 BGA solder joints during thermal aging test;Materials Research Express;2021-10-01

3. Investigation of Cu particles size and bonding time on the microstructure and shear property of Cu/In-45Cu/Cu solder joints;Materials Research Express;2020-01-01

4. Correlation Between the Growth of Voids and Ni3Sn4 Intermetallic Compounds at SnAg/Ni and SnAgCuBiSbNi/Ni Interfaces at Temperatures up to 200°C;Journal of Electronic Materials;2019-10-31

5. Investigating the Effect of Ag Content on Mechanical Properties of Sn-Ag-Cu Micro-BGA Joints;Journal of Electronic Materials;2019-07-16

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