Effects of NCF and UBM Materials on Electromigration Reliabilities of Sn-Ag Microbumps for Advanced 3D Packaging

Author:

Son Kirak,Kim Gahui,Ryu Hyodong,Park Gyu-Tae,Son Ho-Young,Kim Nam-Seog,Yang Cheol-Woong,Kim Young-Cheon,Han Jeong Sam,Park Young-Bae

Publisher

IEEE

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Palladium Films as Electrodes on Carbyne-Based Devices;2023 IEEE 33rd International Conference on Microelectronics (MIEL);2023-10-16

2. Reliability Simulation and Modeling in Memory Packaging;Springer Series in Reliability Engineering;2023

3. Tight-Pitched 10 μm-Width Solder Joints for c-2-c and c-2-w 3D-Integration in NCF Environment;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

4. 7-μm-thick NCF technology with low-height solder microbump bonding for 3D integration;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06

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