Author:
Malta Dean,Gregory Christopher,Temple Dorota,Knutson Trevor,Wang Chen,Richardson Thomas,Zhang Yun,Rhoades Robert
Cited by
16 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Detection and Classification of Typical Defects in TSV and RDL;2019 20th International Conference on Electronic Packaging Technology(ICEPT);2019-08
2. Improvement of via dishing and non-uniformity in TSV chemical mechanical planarization;Microelectronic Engineering;2016-02
3. Fault-Tolerant 3D-NoC Architecture and Design;Proceedings of the 9th International Symposium on Networks-on-Chip;2015-09-28
4. Electroplated Copper for Heterogeneous Die Integration;IEEE Transactions on Components, Packaging and Manufacturing Technology;2015-07
5. Heterogeneous 2.5D integration on through silicon interposer;Applied Physics Reviews;2015-06