Author:
Mavinkurve A.,Goumans L.,Farrugia M. L.,Van Olst E.,Van Soestbergen M.,Rongen R.T.H.,Bumrungkittikul B.
Cited by
2 articles.
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1. Enhancing Cu Wire-Bonding Reliability by a Cu-Selective Passivation Coating;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Reliability and Failure of Microelectronic Materials;Reliability of Organic Compounds in Microelectronics and Optoelectronics;2022